MacroVoids in assembled BGA packages

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C.

BGA Assembly Sierra Circuits

Effect of Voids on Thermo- Mechanical Reliability of Solder Joints

Microsectioning - Short Technical Notes Archives - EEE Parts

A Comprehensive Guide to BGA Substrates

Robustness of BGAs: Parametric study of voids' distribution in SAC

Microsectioning - Short Technical Notes Archives - EEE Parts

BGA models with macro voids at different locations.

Microsection Inspection / Failure Analysis

Recent developments in advanced polymeric materials for solder

Ball Grid Array, BGA Assembly Services, SMT Manufacturer